Title:
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2008251781
Kind Code:
A
Abstract:
To decrease a deformation in a semiconductor wafer in steps of manufacturing a semiconductor device.
A carrier substrate is bonded onto the main surface of the semiconductor wafer when the back surface of a semiconductor wafer is cut, whereas the carrier substrate is bonded onto the back surface of the semiconductor wafer, when a terminal or a sealing resin is formed on the main surface of the semiconductor wafer. Even for any one of steps of at least from cutting of the semiconductor wafer to cutting of the wafer into individual pieces, the carrier substrate is provided to either of the surfaces of the semiconductor wafer, thus suppressing warpages and deformations of the semiconductor wafer.
Inventors:
FUCHINOUE KENJI
Application Number:
JP2007090448A
Publication Date:
October 16, 2008
Filing Date:
March 30, 2007
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
MIYAZAKI OKI DENKI KK
MIYAZAKI OKI DENKI KK
International Classes:
H01L21/301; H01L21/304; H01L23/12
Domestic Patent References:
| JP2001196404A | 2001-07-19 | |||
| JP2003229450A | 2003-08-15 | |||
| JP2004327464A | 2004-11-18 |
Attorney, Agent or Firm:
Koichi Suzuki