Title:
CHEMICAL MACHINE POLISHING DEVICE AND MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE CHEMICAL MACHINE POLISHING DEVICE
Document Type and Number:
Japanese Patent JPH10193252
Kind Code:
A
Abstract:
To improve flatness of a polishing objective film on a semiconductor wafer in a chemical machine polishing method.
A polishing pad 1 provided in a chemical machine polishing device, in the case of dressing, all includes a wafer polishing region 4 in a swivel range of a dresser 2, it is swiveled at a fixed speed between one swivel end and the other swivel end on a radius of the polishing pad 1, and stopped in one swivel end or the other swivel end. In this way, a dress amount of the wafer polishing region 4 of the polishing pad 1 is almost averaged, good uniformity of a polishing amount is ensured by the wafer polishing region 4 of the polishing pad 1.
Inventors:
TAGUMA YUICHIRO
KONISHI NOBUHIRO
ITO HIDEFUMI
MITANI SHINICHIRO
KIMURA TAKESHI
KONISHI NOBUHIRO
ITO HIDEFUMI
MITANI SHINICHIRO
KIMURA TAKESHI
Application Number:
JP40197A
Publication Date:
July 28, 1998
Filing Date:
January 06, 1997
Export Citation:
Assignee:
HITACHI LTD
International Classes:
B24B53/017; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Attorney, Agent or Firm:
Yamato Tsutsui
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