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Title:
CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
Japanese Patent JPH10193257
Kind Code:
A
Abstract:

To prevent a reverse flow of a constitutional element of individual slurry by a check valve in a distribution system, prevent mixing of a constitutional element through a separate distribution line, prevent solidification, and mix a manifold piece element in the vicinity as near as possible of a polishing roller.

A polishing machine distribution feeds an abrasive constitutional element from a vessel through check valves 164, 166, these constitutional elements are distributed through a part of manifold 168, to be mixed in a groove by a mixed element. This mixed abrasive is distributed to a polishing roller 132 by a partially divided flexible supply pipe 170. By mixing the constitutional element in the vicinity as near as possible of the check valve and a distribution point, the abrasive is prevented from being solidified in a distribution line, a line seal by generation of a particle is prevented. Only a part of pipe of a polishing system is exposed in the mixed abrasive, and since manufacturing cost of a pipe is low, even if solidification easily occurs, replacement can be performed at a low cost.


Inventors:
ADAM MANZONI
RON C SPINER
Application Number:
JP31890797A
Publication Date:
July 28, 1998
Filing Date:
November 04, 1997
Export Citation:
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Assignee:
MOTOROLA INC
International Classes:
B24B37/00; H01L21/304; H01L21/306; (IPC1-7): B24B37/00; H01L21/304; H01L21/306
Attorney, Agent or Firm:
Shinsuke Onuki (1 person outside)