Title:
CIRCUIT BOARD AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2016032080
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a composition which makes it easy to inhibit creep deformation of a flexible layer in a circuit board at least partially composed of the flexible layer.SOLUTION: A circuit board 10 includes: a layered part 20 in which a conductor layer 24 and an insulation layer 26 are layered; and a fixing part 5 partially inserted in the layered part 20. The fixing part 5 includes a first depressing part 81a and a second depressing part 74a which sandwich the layered part 20 in a thickness direction. The circuit board 10 includes: a first hole part 30 composed to pierce the layered part 20 in the thickness direction; and a reinforcement part 40 arranged at a position closer to the first hole part 30. The reinforcement part 40 includes: a second hole part 42 composed to extend in the thickness direction of the layered part 20 at a position of the layered part 20 and closer to the first hole part 30; and a reinforcement material 44 which is composed of a material having an elastic modulus higher than that of the flexible layer 27 and arranged with a composition extending in the second hole part 42 in the thickness direction.SELECTED DRAWING: Figure 1
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Inventors:
SAKANASHI YOSHIE
TAKESHIMA KENICHI
HAYASHI MICHIHARU
TAKESHIMA KENICHI
HAYASHI MICHIHARU
Application Number:
JP2014155320A
Publication Date:
March 07, 2016
Filing Date:
July 30, 2014
Export Citation:
Assignee:
DENSO CORP
NIPPON CMK KK
NIPPON CMK KK
International Classes:
H05K3/46
Domestic Patent References:
| JPH08288672A | 1996-11-01 | |||
| JP2004214445A | 2004-07-29 | |||
| JP2000299564A | 2000-10-24 | |||
| JP2007149870A | 2007-06-14 | |||
| JP2002100879A | 2002-04-05 |
Attorney, Agent or Firm:
Akito Tashita