Title:
CIRCUIT BOARD AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2021027079
Kind Code:
A
Abstract:
To suppress breakage of an electronic component.SOLUTION: A circuit board that has a first surface and a second surface being opposite to the first surface comprises: a plurality of semiconductor chip lands that are provided on the first surface, and that are jointed by semiconductor chips; and a plurality of electronic component lands that are provided on the second surface, and that have terminal electrodes of the electronic components including body parts and terminal electrodes tightly adhering to the body parts jointed by soldering at places tightly adhering to the body parts. In the circuit board, the plurality of electronic component lands are arranged relative to the plurality of semiconductor chip lands such that the electronic components are arranged on outer peripheral parts of the semiconductor chips in a plan view of the circuit board, the plurality of electronic component lands include first electronic component lands and second electronic component lands, and at least a portion of widths of the first electronic component lands is narrower than width of the second electronic component land.SELECTED DRAWING: Figure 6
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Inventors:
ONUKI HIROSHI
Application Number:
JP2019141321A
Publication Date:
February 22, 2021
Filing Date:
July 31, 2019
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K3/34; H01L23/12; H05K1/18
Attorney, Agent or Firm:
Shuhei Katayama