Title:
電流検出用抵抗器の実装基板およびその製造方法
Document Type and Number:
Japanese Patent JP5309361
Kind Code:
B2
Inventors:
Koichi Hirasawa
Keishi Nakamura
Satoshi Chiku
Keishi Nakamura
Satoshi Chiku
Application Number:
JP2009006215A
Publication Date:
October 09, 2013
Filing Date:
January 15, 2009
Export Citation:
Assignee:
KOA Corporation
International Classes:
H01C13/00; H05K1/02; H05K1/11; H05K3/34
Domestic Patent References:
JP2002372551A | ||||
JP2003232814A | ||||
JP2005164469A |
Attorney, Agent or Firm:
Shintaro Hotta
Previous Patent: 半導体装置およびその製造方法
Next Patent: TREATMENT OF OBJECT WATER FOR TREATMENT AND MULTIPLE-ELECTRODES-TYPE ELECTROLYTIC BATH FOR TREATMENT...
Next Patent: TREATMENT OF OBJECT WATER FOR TREATMENT AND MULTIPLE-ELECTRODES-TYPE ELECTROLYTIC BATH FOR TREATMENT...