Title:
CIRCUIT BOARD STRUCTURE
Document Type and Number:
Japanese Patent JP3492025
Kind Code:
B2
Abstract:
PURPOSE: To prevent the space between circuit boards from deviating due to thermal fluctuation by forming the first and second circuit boards of material having thermal expansion coeff. equal to or nearly equal to the thermal expansion coefficient of a semiconductor element and a printed circuit board for mounting package in a hybrid.
CONSTITUTION: A first circuit board 1 of which material has a thermal expansion coeff. equal to or nearly equal to the thermal expansion coefficient of a semiconductor element 8, and a second circuit board 3 of which material has a thermal expansion coeff. equal to or nearly equal to the thermal expansion coefficient of a printed circuit board 12 for mounting package, are joined with elastic conductive adhesive to be hybrid (fusion). Then, stress due to the difference in thermal coefficient of expansion is absorbed, thus preventing the space between a semiconductor element 8 and the first circuit board 1 and that between the second circuit board 3 and the printed circuit board 12 for mounting package from deviating due to thermal fluctuation. Therefore, no crack is generated between the semiconductor element 8 and the first circuit substrate 1 and between the second circuit board 3 and the printed circuit board 12 for mounting package, thus achieving a reliable circuit board.
Inventors:
Kenichiro Miyahara
Application Number:
JP13626495A
Publication Date:
February 03, 2004
Filing Date:
June 02, 1995
Export Citation:
Assignee:
Tokuyama Corporation
International Classes:
H01L25/00; H01L23/12; H01L23/32; (IPC1-7): H01L23/32; H01L23/12
Domestic Patent References:
| JP774282A | ||||
| JP8153832A |
Attorney, Agent or Firm:
Fujishima Ijima (1 outside)
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