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Title:
COATING COMPOSITION FOR SEED
Document Type and Number:
Japanese Patent JPS63280001
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled composition applicable to all kinds of seeds and effective in preventing agglomeration of even minute seeds in coating treatment and keeping the seeds from mutual adhesion even by storing in hot and humid atmosphere over a long period, by using a specific polymer and a specific polyalkylene glycol as essential components.

CONSTITUTION: The objective composition contains, an essential components, (A) at least one kind of polymer selected from homopolymer of (meth) acrylamide, (meth)acrylic acid or its salt, preferably Na, K or ammonium salt and a copolymer of (meth)acrylamide and (meth)acrylic acid or its salt and (B) a polyalkylene glycol which is solid at normal temperature. The composition is applied to the surface of a seed in one or more layers. Since the composition gives a smooth and hard coating film, the seed coated with the composition is durable to mechanical impact caused by seeding machine, etc., exhibits high initial germination rate and initial growing rate and keeps high germination rate and growing rate even after the storage over a long period.


Inventors:
OOTANI TAKAMASA
HOTTA HIROSHI
HIRATSUNA SATOSHI
TAKII DENICHI
Application Number:
JP11518787A
Publication Date:
November 17, 1988
Filing Date:
May 12, 1987
Export Citation:
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Assignee:
DAI ICHI KOGYO SEIYAKU CO LTD
TAKII SHIYUBIYOU KK
International Classes:
A01C1/06; A01N3/00; A01N25/00; (IPC1-7): A01C1/06; A01N3/00; A01N25/00
Attorney, Agent or Firm:
Asahina Sota



 
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