Title:
COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD
Document Type and Number:
Japanese Patent JP2006093321
Kind Code:
A
Abstract:
To provide a component mounting apparatus suitable for chip-on-chip mounting.
The component mounting apparatus 1 has a component transfer head device 35. The component transfer head device 35 transfers a first component to a mounting stage 37 from a component supply and collecting part 11, and a second component is transferred to a component delivery position from component supply and collecting part 11 so as to deliver the component to a mounting head device 36. A mounting head device 56 mounts the second component in the first component on the mounting stage 37. The component transfer head device 35 returns the mounted components to the component supply and collecting part 11 from the mounting stage 37.
Inventors:
UENO YASUHARU
HIRATA SHUICHI
MORIKAWA MAKOTO
ONOBORI SHUNJI
HIRATA SHUICHI
MORIKAWA MAKOTO
ONOBORI SHUNJI
Application Number:
JP2004275487A
Publication Date:
April 06, 2006
Filing Date:
September 22, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/60; H01L21/50
Domestic Patent References:
| JP2004186182A | 2004-07-02 | |||
| JPH05315400A | 1993-11-26 |
Attorney, Agent or Firm:
Osamu Kawamiya
Atsushi Maeda
Yoshiyuki Maebori
Atsushi Maeda
Yoshiyuki Maebori
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