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Title:
COMPONENT MOUNTING DEVICE
Document Type and Number:
Japanese Patent JPH04262596
Kind Code:
A
Abstract:

PURPOSE: To improve productivity by so deciding a mounting order as to shorten a time for preparing a component of a supply unit of a mounting machine or to short a mounting time of one board in a state that the number of components to be mounted by one facility is many in a component mounting device for sucking a chip component, etc., to a mounting head and mounting it on a board with adhesive.

CONSTITUTION: With a structure having means 1 for collecting designing information for one board, means 2 for collecting each facility supply unit securing means, means 3 for observing preceding relation of components based on head information, means 4 for dividing the components into a plurality of groups according to speeds, and means 5 for minimizing the movements of a supply unit cassette and a board table, a mounting order is so decided that a time for preparing the component of the supply unit of a mounting machine is shortened, a mounting time for one board is shortened.


Inventors:
MASUDA SEI
YOKOMORI TADASHI
Application Number:
JP2318091A
Publication Date:
September 17, 1992
Filing Date:
February 18, 1991
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/00; H05K13/04; (IPC1-7): H05K13/00; H05K13/04
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)



 
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