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Title:
COMPOSITE MATERIAL OF RUBBER SUBSTRATE/THERMAL ADHESIVE MATERIAL AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP3875072
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To thermally bond a rubber substrate and a thermal adhesive material simply and strongly.
SOLUTION: The composite material comprising the rubber substrate/thermal adhesive material is constituted by thermally bonding the rubber substrate having a thermoplastic elastomer coated surface as an adhesive surface to the thermal adhesive material. A composite material manufacturing method is also disclosed.


Inventors:
Atsushi Mimata
Kano Kano
Application Number:
JP2001343185A
Publication Date:
January 31, 2007
Filing Date:
November 08, 2001
Export Citation:
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Assignee:
St Corporation Chemical Co., Ltd.
International Classes:
A41D19/00; B32B25/08; A41D19/04; B29C65/48; B29K21/00; (IPC1-7): B32B25/08; A41D19/00; A41D19/04; B29C65/48; //B29K21:00
Domestic Patent References:
JP7308992A
JP58098234A
JP2255102A
JP60179251A
JP10025606A
JP61142815U
JP8284005A
JP7138869A
JP55128002A
Attorney, Agent or Firm:
Nobuo Ono