Title:
Conductive adhesion material
Document Type and Number:
Japanese Patent JP6197336
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an Sn-Zn-Sb electric conductive adhesion material having excellent heat resistance and improved adhesion strength to inorganic nonmetal.SOLUTION: In order to improve the strength of electric conductive adhesion material itself, the content of Sb is defined, for an alloy composition comprising Zn: 0.3-15 mass% and Sb: 3-16 mass% with the balance being Sn.
Inventors:
Minoru Ueshima
Isamu Osawa
Isamu Osawa
Application Number:
JP2013073459A
Publication Date:
September 20, 2017
Filing Date:
March 29, 2013
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
C22C13/02; B23K1/00; B23K1/19; B23K35/26; C03C27/04; C22C13/00; H01L31/0224
Domestic Patent References:
| JP2011235294A | ||||
| JP5780365B2 |
Attorney, Agent or Firm:
Shoichi Hirose
Previous Patent: A determining device, the judgment method, and a program of a non-destructive test
Next Patent: PICTURE TRANSMITTER
Next Patent: PICTURE TRANSMITTER