To provide a conductive circuit and a manufacturing method thereof, where a circuit pattern can be easily formed.
A conductive circuit is formed on a circuit board through a manner where metal silver that originates in silver halide on an unexposed part serves as catalytic nucleuses on the circuit board, and a metal film is turned to a circuit pattern generated on the catalytic nucleuses to serve as the conductive circuit. A photosensitive layer that contains silver halide emulsion is formed on a circuit board, silver halide contained in an exposed part is developed in the photosensitive layer, silver halide contained in an unexposed part is dissolved, metal silver is formed at developing, metal silver is deposited on a circuit board, then the photosensitive layer is removed, and a metal film is formed by making the deposited metal silver serve as catalytic nucleuses for the formation of a conductive circuit.
NAKAGAWA KUNIHIRO
HYODO KENJI
