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Patent Searching and Data


Title:
CONDUCTIVE MOLDED PRODUCT AND EXOTHERMIC ELEMENT
Document Type and Number:
Japanese Patent JP2005187708
Kind Code:
A
Abstract:

To provide a conductive molded product and an exothermic element excellent in long term stability with stable resistance value having positive temperature coefficient at high temperatures while maintaining proper molding properties.

The conductive molded product is molded by crosslinking the mixture of a resin component consisting of 50-90 wt.% of crystalline polymer with the melt flow rate of 0.5-10 g/10 minutes, 10-50 wt.% of conductive particles and 0.01-0.5 wt.% of an organic peroxide, to the crystalline polymer, wherein the ratio Ea/EaO of the apparent activation energy EaO of the resin component and the apparent activation energy Ea of the molded product, is 1.1-3.0.


Inventors:
KUROKAWA SHINICHI
Application Number:
JP2003432660A
Publication Date:
July 14, 2005
Filing Date:
December 26, 2003
Export Citation:
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Assignee:
IDEMITSU KOSAN CO
International Classes:
C08J5/00; C08K3/04; C08K3/08; C08K5/14; C08L101/00; (IPC1-7): C08J5/00; C08K3/04; C08K3/08; C08K5/14; C08L101/00
Attorney, Agent or Firm:
Kihei Watanabe