Title:
CONDUCTIVE PASTE AND MANUFACTURE OF ELECTRONIC PART USING THE SAME
Document Type and Number:
Japanese Patent JPH11283442
Kind Code:
A
Abstract:
To provide a conductive paste composed chiefly of silver and palladium and capable of forming a uniform electroless plating film excellent in adhesion to bases and low in specific resistance, for use in fabricating sintered electrode films on the bases and terminals of various electronic parts.
In a conductive paste comprising conductive powders, palladium powders, glass frit powders, an organic binder, and an organic solvent, 1 to 2 wt.% relatively large palladium particles with average particle diameters of 0.5 to 1.5 μm are added to the conductive powders to form nodular projections of an alloy of palladium and silver on a baked surface to thereby provide a film which is excellent in adhesion to bases and low in specific resistance.
Inventors:
NAKAMURA AKIRA
Application Number:
JP8359698A
Publication Date:
October 15, 1999
Filing Date:
March 30, 1998
Export Citation:
Assignee:
TDK CORP
International Classes:
H01B1/22; C09D5/24; H01B13/00; (IPC1-7): H01B1/22; C09D5/24; H01B13/00