Title:
CONDUCTIVE PLATED FIBROUS STRUCTURE, AND ITS PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP2005048243
Kind Code:
A
Abstract:
To provide a conductive plated fibrous structure having an electroless plating film excellent in film appearance, adhesion and electric properties and formed with metal silver as a catalyst.
The conductive plated fibrous structure comprises a nonconductive fibrous structure and an electroless plating film formed on the nonconductive fibrous structure with metal silver as catalyst nuclei. The electric resistance value of the electroless plating film is ≤0.5Ω.
Inventors:
SUZUKI YOSHIHIRO
NOTSU MASAHIRO
MINAMI YUKIE
TACHIBANA SHINJI
YAMAMOTO HISAMITSU
NOTSU MASAHIRO
MINAMI YUKIE
TACHIBANA SHINJI
YAMAMOTO HISAMITSU
Application Number:
JP2003282250A
Publication Date:
February 24, 2005
Filing Date:
July 30, 2003
Export Citation:
Assignee:
UYEMURA C & CO LTD
International Classes:
C23C18/31; D06M11/83; D06M13/513; (IPC1-7): C23C18/31; D06M11/83; D06M13/513
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Saori Shigematsu
Katsunari Kobayashi
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