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Patent Searching and Data


Title:
CONDUCTIVE RESIN COMPOSITION AND ITS MOLDED ITEM
Document Type and Number:
Japanese Patent JPH07307594
Kind Code:
A
Abstract:

PURPOSE: To acquire conduction readily and surely by acquiring a curing matter whose essential elements are synthetic resin and conductive powder and conductive powder is separated and precipitated from a synthetic 9& resin layer during curing, thus forming a double layer structure of a synthetic resin layer and a conductive powder layer.

CONSTITUTION: As synthetic resin, thermosetting resin, thermoplastic resin or mixture resin thereof is used. As conductive powder, gold powder, silver powder, copper powder, nickel powder, carbon powder, powder with a conductive layer in a surface, etc., single or a mixture of two or more kinds thereof is used. Essential elements of a conductive resin composition is synthetic resin and conductive powder, and a small amount of solvent, coupling agent and other additive for viscosity adjustment are mixed. In the conductive resin composition, conductive powder is separated and precipitated during curing and a molded item of a double layer structure of a synthetic resin layer and a conductive powder layer is acquired. Conduction can be acquired surely without the necessity for increasing an amount of metallic insert and conductive filler by using the conductive powder layer.


Inventors:
MATSUDA OSAMU
Application Number:
JP12181794A
Publication Date:
November 21, 1995
Filing Date:
May 11, 1994
Export Citation:
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Assignee:
TOSHIBA CHEM CORP
International Classes:
H05K1/09; C08J5/00; C08J7/04; C08K3/00; C08L101/00; H01Q17/00; H05K9/00; (IPC1-7): H05K9/00; C08J5/00; C08K3/00; C08L101/00; H01Q17/00; H05K1/09
Attorney, Agent or Firm:
Eiji Morota