Title:
CONNECTION STRUCTURE OF FLEXIBLE WIRING CIRCUIT BOARD, AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2008187154
Kind Code:
A
Abstract:
To provide a connection structure of a flexible wiring circuit board that effectively prevents the disconnections of conductive patterns thereof due to its continuous use and to provide an electronic device having the same.
In a sliding mobile telephone 21 whose lower side case body 23 is slidably disposed facing an upper side case body 22, the flexible wiring circuit board 1 to electrically connect an upper side connector 26 on an upper side board 24 of the upper side case body 22 and a lower side connector 27 on a lower side board 25 of the lower side case body 23 is disposed on a way to a long length direction of the flexible wiring circuit board 1 in a twisted or winding manner.
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Inventors:
HO VOON YEE
HU SZU-HAN
HU SZU-HAN
Application Number:
JP2007021958A
Publication Date:
August 14, 2008
Filing Date:
January 31, 2007
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
H05K1/14; H05K1/02
Attorney, Agent or Firm:
Hiroyuki Okamoto
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