Title:
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2023146209
Kind Code:
A
Abstract:
To prevent initial conduction reliability from being reduced and also suppress occurrence of short-circuiting even in a case where conductive particles of which the average particle diameter is smaller than 3 μm are used for an application to high-density mounting regarding a connection structure in which a first electronic component and a second electronic component are connected via an insulation adhesive and the conductive particles disposed between an electrode of the first electronic component and an electrode of the second electronic component.SOLUTION: A connection structure, in which a first electronic component and a second electronic component are connected via conductive particles and an insulation adhesive disposed between an electrode of the first electronic component and an electrode of the second electronic component, uses conductive particles of which the average particle diameter is smaller than 3 μm and the compression hardness (K value) under 20% deformation is 1500 N/mm2 or more and 8000 N/mm2 or less.SELECTED DRAWING: Figure 1
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Inventors:
NODA DAIKI
AIZAKI RYOTA
AIZAKI RYOTA
Application Number:
JP2022053284A
Publication Date:
October 12, 2023
Filing Date:
March 29, 2022
Export Citation:
Assignee:
DEXERIALS CORP
International Classes:
H01R11/01; C09J9/02; C09J201/00; H01B1/00; H01B1/22; H01B5/16; H01R43/00
Attorney, Agent or Firm:
Patent Attorney Corporation Taji International Patent Office