To prevent any distortion from being generated in a cooler for a semiconductor, and to prevent a semiconductor chip from coming out of a cooler for a semiconductor when the semiconductor chip and the cooler for the semiconductor is thermally expanded.
This cooler for a semiconductor includes at least an upper plate 100a, an intermediate plate 3, and a lower plate 200a; and comprises an entrance part 101 and exit 202 and channel 31 of a cooling medium for cooling a semiconductor chip. The upper plate 100a and the lower plate 200a are configured as a composite plate configured by carrying out copper plating whose thickness is 0.05 mm or more to one side or both sides of an auxiliary plate constituted of materials whose tensile strength is 1,000N/mm2 or more, and whose thermal conductivity is 100W/m K or more and whose thermal expansion ratio is 6.0 ppm/°C or less.
YAMAOKA TAKAYUKI
SENOO SATOSHI
Kyoko Kawamura
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