HOLLOW PACKAGE FOR SEMICONDUCTOR ELEMENT

Title:

HOLLOW PACKAGE FOR SEMICONDUCTOR ELEMENT

Document Type and Number:

Japanese Patent JP2005217212

Kind Code:

A

Abstract:

To provide a thin hollow package for storing a thin semiconductor element having moisture resistance which is more than equivalent to that of a conventional resin hollow package.

This hollow package for storing a semiconductor element is configured as a hollow package for a semiconductor element constituted of a resin composition and a conductive lead, and one or both of a package external bottom face and a package internal element loading face(die attach part) are provided with a metal plating layer whose thickness is 0.5 μm or more and 20 μm or less. The metal plating layer is functioned as a moisture non-penetration film.

Inventors:

SUZUKI DAISUKE
INADA KUNIHIRO
SATO KUNIAKI
KATO NAOYUKI

Application Number:

JP2004022459A

Publication Date:

August 11, 2005

Filing Date:

January 30, 2004

Export Citation:

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Assignee:

MITSUI CHEMICALS INC

International Classes:

H01L23/08; (IPC1-7): H01L23/08

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