COOLING DEVICE INCLUDING ETCHED MICRO-CHANNEL

Title:

COOLING DEVICE INCLUDING ETCHED MICRO-CHANNEL

Document Type and Number:

Japanese Patent JP2015008290

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To increase an effective cooling region of a cooling device and efficiently cool a minute electronic chip to which the cooling device is attached.SOLUTION: A cooling device 50 includes a silicon substrate 22 on which a first trench 28a, a second trench 28b, and multiple channels 46 extending between the first trench 28a and the second trench 28b are defined. The silicon substrate 22 defines a first surface and a second surface which is located at substantially the opposite side of the first surface and is substantially parallel with the first surface. The multiple channels 46 extend substantially parallel with the surfaces of the silicon substrate 22. The cooling device 50 includes a minute electronic device having a heat generation region. The minute electronic device may be attached to the first surface or the second surface of the silicon substrate 22. The multiple channels 46 are formed between the first trench 28a and the second trench 28b by etching.

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Inventors:

STEVE CHANG

Application Number:

JP2014125225A

Publication Date:

January 15, 2015

Filing Date:

June 18, 2014

Export Citation:

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Assignee:

HONEYWELL INT INC

International Classes:

H01L23/36; B81C1/00; H01L21/306; H01L23/427

Attorney, Agent or Firm:

Ono Shinjiro
Kobayashi 泰
Shigeo Takeuchi
Yamamoto 修
Yukio Kanegae

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