Title:
COOLING MECHANISM
Document Type and Number:
Japanese Patent JP2011184751
Kind Code:
A
Abstract:
To provide a cooling mechanism capable of enhancing cooling efficiency of a film-deposition substrate.
The cooling mechanism 2 includes a lower surface cooling plate 21, a lifting mechanism 22 and an upper surface cooling plate 25. The cooling mechanism 2 cools a substrate 11 via a tray 32 by bringing the lower surface cooling plate 21 into contact with the tray 32 supporting the substrate 11. Thus, the substrate 11 is cooled by conducting heat to the lower surface cooling plate 21 via the tray 32 and a heat conducting member.
Inventors:
MIYAZAKI YOSHIMASA
Application Number:
JP2010052108A
Publication Date:
September 22, 2011
Filing Date:
March 09, 2010
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
C23C14/50
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Yoshiki Kuroki