To provide a copper alloy foil for laminate with small surface roughness, which can be directly bonded with a polyimide film without being roughened, because of adequate wettability with a varnish including polyamic acid, in a two-layer printing circuit board which makes the resin substrate from the varnish as a raw material.

The copper alloy foil including one or more of 0.01-0.5 mass% Fe, 0.02-1.0 mass% Ni, and 0.02-1.0 mass% Co, in the range of less than 1.0 mass% in total, 0.05-0.2 times amount of the above total elements of P, as added elements, and the balance copper with unavoidable impurities, having sufficient wettability with the varnish by making the thickness of a rust preventive film less than 5 nm from the surface, having superior strength and electroconductivity, and having bonding strength with a coating, which is formed by means of curing polyamic acid, of 0.8 N/cm or more in an 180-degree peeling strength, without being roughened, is provided.