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Patent Searching and Data


Title:
COPPER CLAD SUBSTRATE
Document Type and Number:
Japanese Patent JPS63276297
Kind Code:
A
Abstract:

PURPOSE: To obtain a copper clad substrate excellent for the magnetic shielding effect by constituting the copper clad substrate of a superconductive board and a copper foil adhered to the superconductive board through an insulating layer.

CONSTITUTION: A copper clad substrate is constituted of a superconductive board 4 and a copper foil 3 adhered to the superconductive board 4 through an insulating layer 2. When the superconductive board 4 presents a superconductivity phenomenon, the anti-ferromagnetism is also presented at the same time. Accordingly, the magnetism can't pass through the superconductive board 4. Therefore, even a ferromagnetic substance gets close to the superconductive board 4, the magnetism from the opposite side based on the border of the superconductive board 4 has no effect on the ferromagnetic substance. According to the constitution, the copper clad substrate excellent for the magnetic shielding effect can be obtained.


Inventors:
SUGIMOTO HIDEHIKO
Application Number:
JP11282187A
Publication Date:
November 14, 1988
Filing Date:
May 07, 1987
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K9/00; H01L39/00; H01L39/02; (IPC1-7): H01L39/00; H05K9/00
Attorney, Agent or Firm:
Masuo Oiwa