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Title:
CURABLE COMPOSITION FOR FIBER-REINFORCED RESIN
Document Type and Number:
Japanese Patent JPS62225537
Kind Code:
A
Abstract:

PURPOSE: To provide the titled composition composed of an acrylate resin containing epoxy group, a radically polymerizable monomer, an organic peroxide, an epoxy resin hardener and continuous filaments and/or woven fabric, having high rate of gelatination, easily removable from mold and having excellent fatigue-resistance.

CONSTITUTION: The objective composition can be produced by compounding (A) 60W90(wt)% acrylate resin having epoxy group and unsaturated ester group in the molecule and produced by the addition reaction of an unsaturaged monobasic acid [e.g. (meth)acrylic acid] to a compound having an epoxy equivalent of 100W1,000 and containing ≥2 epoxy groups in a molecule (e.g. glycidyl ether- type epoxy resin, etc.) (the amount of the carboxyl group of the acid is 0.2W0.7 equivalent per 1 equivalent of the epoxy group) with (B) 40W10% radically polymerizable monomer (e.g. styrene), compounding 100pts.(wt.) of the above mixture with preferably 0.1W5pts. of an organic peroxide and preferably 0.5W70pts. of an epoxy resin hardener (e.g. phthalic anhydride) and combining the obtained composition with continuous filaments and/or woven fabric.


Inventors:
SHIBATA JOJI
OTANI KAZUO
SHINOHARA NORIO
HANIYUDA TOSHIAKI
Application Number:
JP6722586A
Publication Date:
October 03, 1987
Filing Date:
March 27, 1986
Export Citation:
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Assignee:
SHOWA HIGHPOLYMER
International Classes:
B29C70/06; B29C70/10; C08F299/02; C08J5/24; C08G59/00; C08G59/20; C08G59/40; C08L63/00; C08L77/00; (IPC1-7): B29C67/14; C08G59/20; C08J5/24
Attorney, Agent or Firm:
Yaguchi flat



 
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