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Patent Searching and Data


Title:
CUTTING APPARATUS
Document Type and Number:
Japanese Patent JP2008149388
Kind Code:
A
Abstract:

To provide a cutting apparatus which can accurately achieve various image data and detected data necessary for cutting work by preventing the dirt of a light receiving lens, etc. of a lens instrument such as an optical sensor, due to chips, and further by easily removing the chips even if the chips have stuck to the light receiving lens.

In order to suppress the sticking of chips, a light emitting lens 64 and the light receiving lens 65 of the optical sensor 60 for setting-up, and the respective surfaces of the respective covers 76, 86 of a camera unit 70 for photographing the wear, chipping, etc. of the cutting edge 32 of a rotary blade 30, are coated with a hydrophilic coating material.


Inventors:
YOSHIDA KEIGO
Application Number:
JP2006337436A
Publication Date:
July 03, 2008
Filing Date:
December 14, 2006
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B23Q17/24; B24B49/12; H01L21/301
Domestic Patent References:
JPH0422207U1992-02-25
JP2865065B21999-03-08
JP2003211354A2003-07-29
Attorney, Agent or Firm:
Suenari Mikio