Title:
CUTTING METHOD USING WIRE SAW AND WIRE SAW
Document Type and Number:
Japanese Patent JP2001232550
Kind Code:
A
Abstract:
To ensure high machining precision while suppressing the wear of guide rollers and wire breaking when cutting is done by a wire saw.
A cutting method using the wire saw and the wire saw are provided to cut a workpiece 28 by feeding it for many wires W stretched over between guide rollers 24A and 24B. A wire tension of a part cutting the workpiece 28 is reduced after it is cut in a predetermined amount after the cutting of the workpiece 28 is started.
More Like This:
| JP6557131 | Split device |
| JP2000094299 | GROUP ROLLER DRIVING METHOD FOR WIRE SAW AND ITS DEVICE |
Inventors:
YAMANAKA TOSHIO
HAMAZAKI TATSUMI
HAMAZAKI TATSUMI
Application Number:
JP2000043072A
Publication Date:
August 28, 2001
Filing Date:
February 21, 2000
Export Citation:
Assignee:
TOYO ADVANCED TECH CO
International Classes:
B24B27/06; B28D5/04; (IPC1-7): B24B27/06; B28D5/04
Attorney, Agent or Firm:
Etsushi Kotani (2 outside)
Previous Patent: WIRE SAW AND CUTTING METHOD USING THE WIRE SAW
Next Patent: SURFACE POLISHING DEVICE FOR PARTICULATE
Next Patent: SURFACE POLISHING DEVICE FOR PARTICULATE