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Patent Searching and Data


Title:
D.C. RELAY
Document Type and Number:
Japanese Patent JP2005019184
Kind Code:
A
Abstract:

To provide a D.C. relay having a simple structure and capable of surely cutting off a D.C. high voltage without fusing a contact.

This D.C. relay is provided with a pair of contact couples which contact to and separate from each other and at least either of which is a moving contact. Each of contact parts 11a, 21a, 31a and 31b of the contacts is formed of a Ag alloy of a chemical composition containing 1-9 mass% of Sn and 1-9 mass % of In, has a first layer of a surface and a second layer of the inside. Micro Vickers hardness of the first layer is not lower than 190; micro Vickers hardness of the second layer is not higher than 130; and the thickness of the first layer is set in a range of 10-360 μm.


Inventors:
IMANISHI HIROYUKI
ARIYOSHI TAKESHI
YOSHIMURA AKINOBU
Application Number:
JP2003182074A
Publication Date:
January 20, 2005
Filing Date:
June 26, 2003
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01H9/32; H01H1/02; H01H1/023; H01H1/04; H01H9/40; H01H9/44; H01H50/00; H01H50/54; (IPC1-7): H01H50/54; H01H1/02; H01H1/04; H01H9/32; H01H9/40; H01H9/44; H01H50/00
Attorney, Agent or Firm:
Hiroshi Yamano
Hidemi Aoki