Title:
COPPER CONDUCTIVE PASTE AND LAMINATED CERAMIC ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2005019185
Kind Code:
A
Abstract:
To provide copper conductive paste capable of forming an external electrode superior in compactness and plating property.
As for the copper conductive paste containing conductive components made of copper or metal containing copper as a main component, a glass frit and an organic vehicle, the glass frit composed of 33-54 wt% of B2O3, 13-32 wt% of at least one kind selected from CaO, SrO and BaO, 16-26 wt% of Al2O3, and 4-27 wt% of at least one kind selected from Li2O, Na2O and K2O is used. The glass frit may contain 6 wt% or less of CuO additionally.
Inventors:
KAWAGUCHI YOSHIHIRO
Application Number:
JP2003182166A
Publication Date:
January 20, 2005
Filing Date:
June 26, 2003
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/12; H01B1/22; (IPC1-7): H01B1/22; H01G4/12
Attorney, Agent or Firm:
Masaaki Koshiba
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