To provide a defect inspection device and method capable of easily searching for defects when reviewing the defects detected from the plane to be inspected of a body to be inspected such as a semiconductor wafer by an observing device such as a scanning microscope.

The defect inspection device comprises an optical system 12 for guiding luminous flux emergent from a light source 11 to the surface of the semiconductor wafer W, an image pickup device 18 for picking an optical image by reflected light from the surface of the semiconductor wafer W, a computer as a defect extracting means for extracting defects present in the surface of the semiconductor wafer W from the picked-up optical image, and a laser unit 31 as a marking means for marking the extracted defects in the surface of the semiconductor wafer W.