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Title:
DEVICE FOR MACHINING MARGIN OF METAL EVAPORATED FILM
Document Type and Number:
Japanese Patent JP3378357
Kind Code:
B2
Abstract:

PURPOSE: To provide a margin machining device of a metal evaporated film capable of automatically adjusting the position of a mask in an interlocking manner with the change of the position of a longitudinal margin part.
CONSTITUTION: A margin machining device is provided with film feeding mechanisms 30, 38 to travel a metal evaporated film F, a longitudinal laser beam irradiation nozzle 70 which irradiates the laser beam on the metal evaporated film to form a longitudinal margin part, a slider 72 to displace the nozzle to the film width direction, transverse laser beam irradiation mechanisms 40, 42, 46 to form a transverse margin part by irradiating the laser beam while scanning the laser beam R1 in the film width direction, a mask 78 to block the laser beam at the prescribed position, a slider 80 to displace the mask in the film width direction, and a control mechanism 74. The control mechanism 74 moves the longitudinal laser beam irradiation nozzle 70 when the margin position is specified from an input device 74, and calculates the film moving time between the respective laser beam irradiation positions, and the mask 78 is moved at the time when the film moving time is elapsed.


Inventors:
Kouichi Sugimoto
Application Number:
JP13345194A
Publication Date:
February 17, 2003
Filing Date:
June 15, 1994
Export Citation:
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Assignee:
Mitsubishi Shindoh Co., Ltd.
International Classes:
G01B11/02; B23K26/066; B23K26/351; B23K26/361; H01G13/06; B23K101/36; (IPC1-7): H01G13/06; B23K26/00; B23K26/06
Domestic Patent References:
JP1137614A
JP4231185A
JP6151263A
Attorney, Agent or Firm:
Masatake Shiga (2 outside)