To provide a device for manufacturing a semiconductor module having stable communicating characteristics at low costs.
This semiconductor module manufacturing device 1 is provided with a main control part 2 which controls the whole device, an IC characteristic measuring part 3 which measures the frequency characteristics of an IC chip 6, a coil connecting part 4 which winds an antenna coil in an optimal specification corresponding to the frequency characteristics of each IC chip passing through the IC characteristics measuring part 3, and connecting this with the input and output terminals of the corresponding IC chip 6 for obtaining a semiconductor module 10, and an inspecting part 5 which inspects the communication characteristics of the semiconductor module 10 obtained by the coil connecting part 4. The coil connecting part 4 is constituted of a control part 41 connected through an interface circuit with the main control part 2, a coil mechanism part 43 which winds an antenna coil 7 in the optimal specification obtained by the main control part 2, and a connecting mechanism part 42 which connects the antenna coil 7 wound by the coil mechanism part 42 with the IC chip 6 passing through the IC characteristics measuring part 3.
NAKAGAWA KAZUNARI
OMICHI KAZUHIKO
