To prevent information recorded inside an IC chip from being read without using a reader/writer by providing a groove-shaped thin part at the opposite side of a surface on which the circuit of a semiconductor base is formed, applying force to a semiconductor from the outside and destroying the semiconductor base at the groove-shaped thin part.

A semiconductor base 1-1 constituting an IC chip is a plate like semiconductor such as a silicon wafer. The base 1-1 is also a minute matter that can be subjected to watermarking or insertion into a thin and flexible raw material such as paper. A CPU part 1-2 is connected to a memory part 103 and an antenna/power circuit part 1-4 through a bus 1-5 and controls each part. A groove-shaped structure provided on the opposite side of a surface on which the circuit of the base 101 is formed is thinner than the other parts. The base 1-1 can be destroyed at a groove 2 and the circuit of a memory circuit 103 formed in the neighborhood of the groove 2 can be also destroyed by applying force from the outside.