To provide an external semiconductor layer cutting device capable of automatically shaving off the external semiconductor layer of a cable by just a prescribed length.
An external semiconductor layer cutting device is provided with a traveling body 2, which has a feed drive mechanism 14 and moves in the length direction of a cable 1, while the body 2 is put around the cable 1, a rotating body 5 having a cutting blade 4 for shaving off the external semiconductor layer 3 of the cable 1, and a rotating body drive mechanism 41 which rotationally drives the rotating body 5 with respect to the traveling body 2. The cutting device is also provided with a mark body detecting sensor 18, which detects a mark body B for stopping stuck previously to the prescribed position of the cable 1 in the length direction, a feed stop control means 21, which stops the driving mechanism 14 upon receiving the detect signal of the sensor 18, and a rotation stop control means 26 which stops the rotating body 5 after the mechanism 14 has stopped. As a result, the cutting device can automatically shave off the semiconductor layer by just a prescribed length.
MATSUI YASUSHI
TSUBOI HIROSUKE
Next Patent: EXTERNAL SEMICONDUCTOR LAYER CUTTING BLADE