To provide an external semiconductor layer cutting device which is capable of shaving off the external semiconductor layer of a cable, with reduced shave-off amount of the insulator layer inside the semiconductor layer.
An external semiconductor layer cutting device is provided with a traveling body 2, which is put around a cable 1 and travels in the length direction of the cable 1 and a rotating body 5 having a cutting blade 4 which shavs off the external semiconductor layer 3 of the cable 1. The rotating body 5 is attached to the traveling body 2 via a rotating and aligning mechanism 9, which rotatably receives the rotating body 5 such that the cutting blade 4 can move along the outer peripheral surface of the cable 1 and adjusts the relative position of the axis L of the rotating body 5 to the traveling body 2. In an external semiconductor layer cutting method, the cross-sectional shape of the cable 1 is found with virtual true circle as the reference, having its center at the virtual axis center of the cable by rotating a measuring instrument, which measures the position of the outer peripheral surface around the virtual axial center of the cable 1, and then, the direction of the minimum diameter in the cross-sectional shape and the position of the bisecting point of the minimum diameter are successively found. Thereafter, the external semiconductor layer 3 is shaved off by moving the cutting edge 4 along the outer peripheral surface of the cable 1 such that the edge 4 draws a circle around the bisecting point.
MIZOGUCHI TOKU
KANJO HIROHISA
MOTOKOSHI NOBUYUKI
Next Patent: DEVICE AND METHOD FOR CUTTING EXTERNAL SEMICONDUCTOR LAYER