Title:
DEVICE AND METHOD FOR FINISH GRINDING
Document Type and Number:
Japanese Patent JP2016013615
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce the time required for lapping and the amount of used slurry by reducing a machining allowance of lapping in a post-process, and prolong the lifetime of a grinding stone.SOLUTION: A finish grinding device (2) for finish-grinding a surface of a coarse-ground substrate (W) includes: a grinding part (10) which is rotatable and has a grinding stone (12) for grinding the substrate; a chuck (20) which is disposed opposite the grinding stone of the grinding part, and is rotatable while supporting the substrate; a grinding feed part (15) which feeds the grinding part toward the chuck along a rotary shaft thereof; and a grinding ratio changing part (30, 35) which changes a grinding ratio of the substrate to the grinding stone according to the feeding amount of the grinding part fed by the grinding feed part.
Inventors:
KANAZAWA MASAKI
Application Number:
JP2015183987A
Publication Date:
January 28, 2016
Filing Date:
September 17, 2015
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD
International Classes:
B24B7/04; B24B53/00; B24B53/02; B24B53/12; H01L21/304
Domestic Patent References:
JP2000326210A | 2000-11-28 | |||
JP2003338479A | 2003-11-28 | |||
JP2009231475A | 2009-10-08 | |||
JP2000317835A | 2000-11-21 | |||
JP2006255851A | 2006-09-28 | |||
JPH0297566U | 1990-08-03 |
Foreign References:
US20040235301A1 | 2004-11-25 |
Attorney, Agent or Firm:
Atsushi Aoki
Tetsuro Shimada
Shinji Mitsuhashi
Hirose Shigeki
Kazuo Maejima
Masahiro Tahara
Tetsuro Shimada
Shinji Mitsuhashi
Hirose Shigeki
Kazuo Maejima
Masahiro Tahara