Title:
DIE FOR CONTROLLING WALL THICKNESS OF PARISON
Document Type and Number:
Japanese Patent JP3118097
Kind Code:
B2
Abstract:
PURPOSE: To make it possible to totally and locally control the wall thickness distribution at respective axial and circumferential portions of parison under the condition that no cutting-in is developed in a die ring, an internal core and the like.
CONSTITUTION: The die concerned is equipped with an internal core, which is located in a die ring 2 and has convergent taper, so as to move vertically relative to the ring 2. Further, at the tip of the internal core 1, and attachment core 3, the angle of taper of the outer peripheral surface of at least some portion of which is made different from that of the other portion, is mounted detachably. By vertically moving the internal core 1 and the attachment core 3 relative to the ring 2, the continuous change of the axial wall thickness and the irregular shaped molding in circumferential section of parison are made possible.
Inventors:
Satoshi Kanazawa
Application Number:
JP26544492A
Publication Date:
December 18, 2000
Filing Date:
September 07, 1992
Export Citation:
Assignee:
SHOWA DENKO K.K.
International Classes:
B29B11/10; B29C48/325; B29C49/00; B29C49/04; B29C49/78; B29L22/00; (IPC1-7): B29B11/10; B29C47/22; B29C49/04; B29C49/78
Domestic Patent References:
| JP62267105A | ||||
| JP6266907A | ||||
| JP2276619A |
Attorney, Agent or Firm:
Seiichi Kikuchi