Title:
DIE FOR MICRO-CRYSTALLIZING GRAIN SIZE
Document Type and Number:
Japanese Patent JP3032762
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a die used for micro-crystallizing grain size of a metal work by an ECAP method which is easy in manufacture and withstandable against the extruding pressure of the metal work.
SOLUTION: In the die for micro-crystallizing the grain size of a work metal by extruding the metal work through a passage of a die having a tunnel-like extrusion passage in which an inlet side straight passage is connected to an outlet side straight passage at a bend part, and applying the large shear strain in the work metal, the die 1 is of the two-split structure, grooves 21, 21a to divide a passage 11 into two sections at the plane including the axis of the extrusion passage 11 are formed on butting surfaces of both die halves 2, 2a, and bend parts of the grooves 21, 21a of the die halves 2, 2a are formed on a cemented carbide.
Inventors:
Mimaki, Takuo
Akamatsu, Kenichi
Akamatsu, Kenichi
Application Number:
JP1999000169281
Publication Date:
February 10, 2000
Filing Date:
June 16, 1999
Export Citation:
Assignee:
AKAMATSU FORSYS KK
International Classes:
B21C37/04; B21C23/00; B21C25/02; (IPC1-7): B21C37/04; B21C23/00; B21C25/02
Previous Patent: カーテン用スプリングクリップ
Next Patent: PAPER FEEDING PART HAVING WEB PAPER TRAVELING TENSION CONTROL DEVICE IN ROTARY PRESS
Next Patent: PAPER FEEDING PART HAVING WEB PAPER TRAVELING TENSION CONTROL DEVICE IN ROTARY PRESS