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Title:
DIE PICKUP DEVICE
Document Type and Number:
Japanese Patent JP2004014923
Kind Code:
A
Abstract:

To improve production efficiency by decreasing the working processes for printing as much as possible.

The die pickup device is provided with a rotary disk 27 provided with a plurality of suction takeout nozzles 26 for picking up and taking out dies or chip components A from a chip component feeder table 24, and arranged on the peripheral rim with a predetermined interval while being turned intermittently; a converting device 36 for converting upside down the suction takeout nozzles 26 after picking the chip components A up in a suction takeout station; and a printing device 66 for printing on the surface of the chip components A in a condition that a printing surface converted upside down by the converting device 36 is made an upper surface, and a surface having a terminal is made a lower surface while descending the chip components A by a Z-axis driving motor 74 in a printing station.


Inventors:
KOMATSU RYUICHI
ICHIKAWA YOSHIO
TOMIZAWA TERUYUKI
Application Number:
JP2002168535A
Publication Date:
January 15, 2004
Filing Date:
June 10, 2002
Export Citation:
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Assignee:
HITACHI HIGH TECH INSTR CO LTD
International Classes:
H01L23/00; H01L21/02; (IPC1-7): H01L23/00; H01L21/02
Attorney, Agent or Firm:
Kiyotaka Aizawa



 
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