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Title:
DISC GRINDING DEVICE AND PLATE THICKNESS CONTROL METHOD FOR DISC GRINDING DEVICE
Document Type and Number:
Japanese Patent JPH05228827
Kind Code:
A
Abstract:

PURPOSE: To control the plate thickness accurately and stably, and improve the yield of products by measuring the initial plate thickness of a disc to be ground, and computing the target grinding quantity on the basis of the initial plate thickness, and stopping a grinding device when the grinding quantity achieves the target grinding quantity.

CONSTITUTION: A grinding device pinches a disc with a carry between a pair of grinding surface plates, which rotate in the directions opposite to each other, to pressurize them, and the carry is epicycle-rotated to grind the disc. In this case, the displacement quantity, which is detected by a displacement quantity detecting unit 7 of the grinding surface plates positioned in the upper, and the existence of the rotation, which is detected by a rotation sensor 90 of the fixed grinder positioned in the lower, are input to a control means 8. The target grinding quantity of the disc to be ground is computed by a computing means 80 on the basis of the initial plate thickness of the disc to be ground. The required standard data is inputted by an input means 9. Furthermore, a result of the computing is displayed by a display means 81, and on the other hand, the upper and the lower grinding surface plates, a driving motor 4 and an elevation driving device 35 are controlled in response to the target grinding quantity.


Inventors:
SATO HIROMITSU
YAMADA SATORU
TODE HIDEKI
Application Number:
JP7225392A
Publication Date:
September 07, 1993
Filing Date:
February 21, 1992
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
B24B37/013; B24B37/07; B24B47/20; B24B49/04; (IPC1-7): B24B37/04; B24B47/20; B24B49/04
Attorney, Agent or Firm:
Shigeo Kono (1 outside)



 
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