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Patent Searching and Data


Title:
DOUBLE SIDE POLISHING DEVICE
Document Type and Number:
Japanese Patent JPH05329768
Kind Code:
A
Abstract:

PURPOSE: To perform simultaneous polishing of the upper and under surfaces of a work in machining removal amounts, being equivalent to each other, through one cycle of a polishing work by providing a difference in hardness between upper and lower surface plates.

CONSTITUTION: Carriers 4 to hold works 3 and perform planetary movement owing to a difference in the number of revolutions between a solar gear 5 and an internal tooth gear 6 are nipped between upper and lower surface plates 1 and 2. The upper and lower surface plates 1 and 2 are rotated in a reverse direction to each other. Machining liquid containing grinding grains are fed from the upper surface plate 1 side and a polishing work is applied on the upper and under surfaces of the work 3. In this case, a difference in a hardness is provided between the upper and lower surface plates 1 and 2. This constitution reduces production of a difference between machining removal amounts of the work 3 machined and removed by the upper and lower surface plates 1 and 2 and effects simultaneous polishing of the upper and under surfaces of the work 3 in machining removal amounts, equivalent to each other, through one cycle of a polishing work.


Inventors:
HIROE SEIICHI
Application Number:
JP16164092A
Publication Date:
December 14, 1993
Filing Date:
May 29, 1992
Export Citation:
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Assignee:
CITIZEN WATCH CO LTD
International Classes:
B24B37/12; B24B37/14; (IPC1-7): B24B37/04