Title:
DOUBLE SIDE POLISHING METHOD HAVING REDUCED SCRATCHED WOUND RATE AND APPARATUS FOR APPLYING THE SAME
Document Type and Number:
Japanese Patent JP3648478
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce scratched wounds on the surfaces of a semiconductor disc in the method that the semiconductor disc is guided by a rotating disc having an annular tooth row rotated in collaboration with an outer tooth row and an inner tooth row of a polishing apparatus in order to manufacture the semiconductor disc by polishing double sides of the semiconductor disc between an upper and a lower rotating polishing trays covered with polishing clothes, under feeding of an alkaline polishing compound including a colloidal solid component.
SOLUTION: (1) A liquid mainly composed of water is sprayed at least contemporarily, at least on either one of both tooth rows of the polishing apparatus. (2) The alkaline polishing compound is continuously fed to the semiconductor disc within a closed feeding device.
Inventors:
Guild venski
Johann Glass
Thomas altman
Gerhard Hire
Johann Glass
Thomas altman
Gerhard Hire
Application Number:
JP2001374878A
Publication Date:
May 18, 2005
Filing Date:
December 07, 2001
Export Citation:
Assignee:
Siltronic AG
International Classes:
B24B37/005; B24B37/08; H01L21/304; H01L21/306; B24B55/06; (IPC1-7): H01L21/304; B24B37/00; B24B37/04; B24B55/06
Domestic Patent References:
| JP63076457U | ||||
| JP2000288922A | ||||
| JP11226863A | ||||
| JP2001105303A |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel