Title:
DOUBLE-SIDED POLISHING METHOD AND DOUBLE-SIDED POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2004042171
Kind Code:
A
Abstract:
To provide a double-sided polishing method and a double-sided polishing device for processing a workpiece such as a wafer for high flatness without causing edge drooping in an outer peripheral part of the workpiece.
In polishing, the workpiece 9 is worked by surrounding the workpiece by annular bodies 8A to 8E separate in the radial direction from this workpiece 9 and forming thick parts 8a to 8d thicker than the finishing thickness of this workpiece 9 in an intermittent circumferential shape via an interval G.
Inventors:
NAKAMURA NOBUKO
MASUNAGA TAKAYUKI
ISOGAI HIROMICHI
MASUNAGA TAKAYUKI
ISOGAI HIROMICHI
Application Number:
JP2002201304A
Publication Date:
February 12, 2004
Filing Date:
July 10, 2002
Export Citation:
Assignee:
TOSHIBA CORP
TOSHIBA CERAMICS CO
TOSHIBA CERAMICS CO
International Classes:
B24B37/005; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Attorney, Agent or Firm:
Norio Ohu
Takehana Kikuo
Hiroshi Uji
Takehana Kikuo
Hiroshi Uji