Title:
DRESSER OF ABRASIVE CLOTH FOR SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JPH10118914
Kind Code:
A
Abstract:
To provide the dresser of the abrasive cloth for a semiconductor substrate without the falling off and loss of a diamond grain.
This is the dresser of an abrasive cloth used in the flattening grinding process of a semiconductor substrate joined a diamond grain 1 with a metal 2 by an electrodeposition method or brazing method and further, is what a seramic coating film 4 on the metal surface is applied. The scratch injury of the semiconductor substrate and grinding cloth by the falling off of the diamond grain is restrained to minimum and the semiconductor substrate with high yield can be produced.
Inventors:
TAMURA MOTONORI
Application Number:
JP27219696A
Publication Date:
May 12, 1998
Filing Date:
October 15, 1996
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
B24B9/00; B24B53/017; B24B53/12; B24D3/00; H01L21/304; (IPC1-7): B24B37/00; B24D3/00
Attorney, Agent or Firm:
Masao Handa
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