To provide a joining material cheaper than an unleaded solder, not requiring a strict temperature management, and having a high joining strength, and to provide an electric appliance having an excellent reliability joined by using such a joining material.

In a method of manufacturing an electric appliance by joining one conductive terminal and other conductive terminal, a molding of a mixture of a metal powder having an average particle size of ≤100 micron and an organic binder that can evaporate or thermally decompose at a lower temperature than a temperature at which this metal powder starts to sinter, is interposed between the both conductive terminals, to thereby allow the metal powder to sinter.