To obtain an electroconductive adhesive capable of being used at a temperature lower than that of soldering and providing good connection even if the connected part is oxidized.

This electroconductive adhesive 30 comprises metal particles, a thermoset resin hardened by heating at a temperature lower than that of soldering, and an active ingredient. The adhesive 30 is laminated on a part land 12 of a layout pattern on a circuit board 10 and an electrode terminal 22 of an electric part 20 is adhered thereto. The part land 12 and the electrode terminal 22 is fixed in an electrically connecting state by heating the adhesive to a temperature lower than that of the soldering to harden the adhesive. The active ingredient included in the adhesive 30 can activate and remove oxide films on the surfaces of the part land 12 and the electrode terminal 22 to provide good connection.