To provide an electrode connecting structure with which cost reduction is achieved and connecting reliability is excellent.

The electrode connecting structure is constituted by electrically connecting a copper foil lead 3 formed on a flexible substrate 2 to an electrode 6 on a panel 5. A projecting part 4 is formed on the surface of the copper foil lead 3 and electrical conduction is attained by contacting of the projecting part 4 with the electrode 6. A plurality of the projecting parts 4 are formed and the height thereof is ≥2 μm and the shape thereof is, for example, hemispherical. The flexible substrate and the panel are bonded and fixed to each other by an ordinary adhesive not containing conductive particles etc.