Title:
ELECTRODE EMBEDDED MEMBER AND SEMICONDUCTOR MANUFACTURING DEVICE COMPONENT
Document Type and Number:
Japanese Patent JP2022124055
Kind Code:
A
Abstract:
To provide an electrode embedded member and a semiconductor manufacturing device component in which the damage due to a thermal influence in a connection part between an external electrode and an electrode terminal is suppressed.SOLUTION: In a heating device (semiconductor manufacturing device component 100), an electrode embedded member 10 includes a ceramic member 11 with a plate shape having a front surface 11a and a back surface 11b on the opposite side of the front surface 11a, an internal electrode 12 provided inside the ceramic member 11, an external electrode 13 electrically connected to the internal electrode 12 and exposed to the back surface 11b side of the ceramic member 11, an electrode terminal 31 connected to the external electrode 13 through a metal material, and a coolant passage 14 formed inside the ceramic member 11 and cooling the external electrode 13.SELECTED DRAWING: Figure 1
Inventors:
WAKAZONO MAKOTO
Application Number:
JP2021021590A
Publication Date:
August 25, 2022
Filing Date:
February 15, 2021
Export Citation:
Assignee:
NGK SPARK PLUG CO
International Classes:
H01L21/683; H05B3/02; H05B3/74
Attorney, Agent or Firm:
Akatsuki Joint Patent Office