To provide a semiconductor element having such an electrode formation that can be used for both wire bonding connection and flip chip bonding connection when mounting the semiconductor element which constitutes a temperature compensated piezo-oscillator.

Electrodes for connection are formed on both principal planes of the semiconductor element. The electrodes for connection have such an electrode structure that can unify the electrodes for connection on both principal planes. Specifically, the electrodes for connection can be unified for connection on both principal planes by having such a terminal connection that the electrodes for connection have the same function on both principal planes of the semiconductor element when the semiconductor element is turned 180° forward or in the right and left direction.